|
|
IBS proposes a various means of etching: wet (resist stripping, metals, SiO2, and Si with TMAH), dry (plasma for resist stripping and Si/SiO2/Si3N4), ion beam etching for any material.
|
|
Dry and Wet etching
There are wet bench area, and plasma area, dedicated to your etching solution.
 For more details |
|
| .................................................................................................................................................................................................................... |
|
|
Silicon etching: TMAH solution
At your disposal, IBS offer you Silicon etching friendly CMOS, with TMAH solution. This process is used for MEMS applications, to release structure.
For more details |
|
| .................................................................................................................................................................................................................... |
|
|
