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IBS offers the broadest range of thermal processing: standard furnace, RTA, laser annealing.
Laser annealing is particularly attractive for Ultra Shallow Junctions (USJ), another key skill of IBS.
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Thermal oxidation
Wet and dry oxidation, LPCVD.
Up to 6 inches. Uniformity is <1% on wafer 4 inches.
 For more details, please contact us:information@ion-beam-services.fr |
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Activation annealing
With furnace for standard process, RTA, laser.
For more details, please contact us :information@ion-beam-services.fr |
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